Microcrack interaction with circular inclusion and interfacial zone

study of dna interaction with ethylenediaminetetraacetic acid and sesamol food additives

برهمکنش dnaتیموس گاوی طبیعی (ct-dna) با اتیلن دی آمین تترااستات (edta)در بافرtris-hcl با 8/7 ph ( دراین ph،edta به نمک دی سدیم تبدیل می شود) وسسامول در بافر tris-hcl با4/7 ph مورد بررسی قرار گرفته است. edta و سسامول استفاده فراوانی در تکنولوژی غذایی و صنعت شیمیایی دارند. مدل اتصال dna مربوط بهedta بوسیله اسپکتروفتومتری جذب، دورنگ نمایی حلقوی(cd)، ویسکومتری وژل الکتروفورز بررسی شده است. طیفuv ...

On Some Benchmark Results for the Interaction of a Crack with a Circular Inclusion

Stress intensity factor calculations for crack-inclusion interaction problems are presented. The problems considered include the benchmark problems first discussed by Helsing and Jonsson, and subsequently by Wang, Mogilevskaya and Crouch. The numerical results are obtained using the symmetric-Galerkin boundary element method in conjunction with an improved quarter-point element for evaluating t...

Mechanics of Materials and Structures INTERACTION BETWEEN A CIRCULAR INCLUSION AND A CIRCULAR VOID UNDER PLANE STRAIN CONDITIONS

Microcrack Initiation and Growth

A Monte Carlo simulation technique to predict the mean and scatter in fatigue lifetime of certain 2000 and 7000 series aluminum alloys is described. The method is based upon models of surface microcrack nucleation and early growth, which comprise the initiation phase of the fatigue failure process. The experimental basis for the models is discussed, and examples of predicted numbers and lengths...

Chip-package interaction and interfacial delamination

In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and services. The concentrated stresses result in delamination on many interfaces on several levels of structures, in various length scales from tens of nanometers to hundreds o...